Principal Mechanical Engineer
Core
Lead architecture, design, development, and industrialization of next-generation high-speed optical transceiver modules (800G, 1.6T) based on the OSFP ecosystem.
Role type
Principal Mechanical Engineer (Optical Transceiver Packaging)
Builds
High-speed optical transceiver modules and related hardware for hyperscale data centers and AI supercomputing.
Domain
Optical networking, semiconductor packaging, data center hardware.
Deliverable
production ML models | product features
Required skills
Mechanical architecture leadership, thermal design & simulation, NPI & manufacturing transfer, supplier management, cost optimization, DFMEA/PFMEA, root cause analysis, program leadership, GD&T & tolerance analysis, EMI/EMC compliance
Preferred skills
800G/1.6T optical module experience, co-packaged optics knowledge, copper alloys/Zamak die casting expertise, OSFP MSA familiarity, Six Sigma certification
Technologies
Creo, SolidWorks, NX, FloTHERM, Icepak, CFD
Responsibilities
Define module architecture and stack-up strategy, design precision components (sheet metal, die castings, injection molded plastics), optimize for thermal performance and structural integrity, drive advanced thermal solutions, lead reliability validation, establish DFM/DFA guidelines, lead supplier qualification, mentor engineering teams
Seniority
Principal, hands-on IC with strategic oversight