Advanced Packaging Intern, BS - Summer 2027
Core
Intern supporting customers with advanced package designs meeting challenging electrical requirements for high-speed signaling and power delivery.
Role type
Intern, hardware design and signal/power integrity verification
Builds
Custom package designs and multi-chip configurations for data infrastructure
Domain
Semiconductor, advanced packaging, electrical engineering
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
electromagnetic fundamentals, signal integrity concepts, circuit simulation techniques, hardware design interest
Preferred skills
circuit extractions, design methodology, design optimization
Technologies
circuit simulation tools
Responsibilities
Evaluating package or PCB designs for challenging electrical requirements, interacting with physical designers and IP teams to optimize electrical performance, executing simulation tasks for signal and power integrity sign-off
Seniority
Intern
