Process Engineer Intern, MS - Summer 2027
Core
Support process development and data tracking for 2.5D/3D chip-on-wafer assembly and co-packaged optics during New Product Introduction (NPI) to enable high-volume manufacturing of AI silicon.
Role type
Process Engineer Intern (Semiconductor Manufacturing)
Builds
AI silicon packages for data center infrastructure
Domain
Semiconductor manufacturing / Advanced packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Data analysis (Excel, JMP, Minitab), Technical documentation, Risk mitigation planning, Cross-functional communication, Independent task management, Semiconductor processing knowledge, Packaging/assembly concepts, Python scripting, Reliability testing basics
Preferred skills
Prior internship in semiconductor/manufacturing, Coursework in materials science or packaging
Technologies
Excel, JMP, Minitab, Python
Responsibilities
Support process development for 2.5D/3D chip-on-wafer and co-packaged optics; Track and analyze packaging build data to identify trends and risks; Document risks and mitigation plans for manufacturing readiness; Participate in meetings regarding design-for-manufacturing and cost-tradeoffs
Seniority
Intern
