Advanced Packaging Design Engineer
Core
Lead Si/package/PCB/system co-design and multi-chip SiP packaging feasibility for Photonic Fabric Systems, optimizing re-use and meeting high-speed interface specifications.
Role type
Senior IC advanced packaging design engineer
Builds
Advanced packaging solutions for Photonic Fabric Business unit
Domain
Semiconductor / Advanced Packaging / Photonic Systems
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Si/package/PCB/system co-design, multi-chip SiP packaging, high-speed interface design (HBM, DDR, PCIe, SerDes), netlist management for chiplet assemblies, substrate and material selection, design for reliability and manufacturability, OSAT engagement
Preferred skills
Photonics packaging, MCAD tools (AutoCAD)
Technologies
Cadence APD, EDA solutions, AutoCAD
Responsibilities
Lead Si/package/PCB/system co-design work, scope package substrate design feasibility, lead package layout based on I/O and form factor requirements, meet specifications for high-speed interfaces, manage netlists for heterogeneous chiplet assemblies, support production and assembly with substrate suppliers and OSATs, participate in qualification of package and board level assembly, drive ideation of advanced package solutions
Seniority
Senior, hands-on IC
