Power Integrity Engineer - Advanced Packaging
Core
Develop advanced microelectronic packages for semiconductors supporting 448 Gb/s data rates, focusing on signal and power integrity optimization.
Role type
Senior IC package development engineer (Power/Signal Integrity)
Builds
Advanced custom package designs for multi-chip and multiple component configurations
Domain
Semiconductor / High-speed data infrastructure
Deliverable
production ML models | product features
Required skills
Signal and Power Integrity, 2-D/3-D electromagnetic simulation, high-speed signaling analysis, power plane design, IC package/PCB layout tools, circuit design tools
Preferred skills
2.5D/3D package development experience
Technologies
Ansys HFSS/SIWave, Cadence Clarity/PowerDC/PowerSI/XtractIM, Keysight ADS, MATLAB, Spectre, HSpice, Ansys Electronics Desktop, Cadence APD, Mentor PADS, Xpedition Package Designer
Responsibilities
Perform package electrical design, modeling, and characterization of high-speed signal channels; interface with layout design teams to ensure manufactability and compliance; collaborate with marketing and IC designers to develop achievable package specs.
Seniority
Mid-level, hands-on IC
