Sr. Staff Engineer, Packaging Engineering
Core
Lead semiconductor IC package development from concept to mass production, focusing on New Product Introduction (NPI) to refine package solutions for data infrastructure.
Role type
Sr. Staff Engineer, Packaging Engineering
Builds
Semiconductor IC packages for cloud, AI, enterprise, and carrier architectures
Domain
Semiconductor manufacturing and packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor packaging design, substrate and RDL expertise, flip-chip package development, 2D/2.5D/3D and wafer-level packaging knowledge, failure analysis techniques, OSAT and substrate supplier management, design for manufacturability, NPI schedule management, reliability standards understanding
Preferred skills
OSAT management experience, 2D/2.5D/3D packaging roadmap development
Technologies
Cadence APD, AutoCAD
Responsibilities
Define optimal package solutions based on end product/client requirements, perform package design reviews, manage OSAT and substrate suppliers for risk assessment and release, provide inputs to design guidelines, achieve NPI milestone dates, resolve package quality and reliability issues, support new package technology development
Seniority
Sr. Staff, hands-on IC with strategic oversight
