Package Integration Engineer
Core
Oversee packaging integration and vendor coordination from design to manufacturing for semiconductor products.
Role type
Package Integration Engineer
Builds
Semiconductor test vehicles and product builds
Domain
Semiconductor manufacturing and packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
DOE principles, manufacturing data analysis, OSAT/vendor coordination, full product life cycle management, material build planning, yield improvement, cross-functional team alignment
Preferred skills
Optical packaging knowledge, systems engineering procedures, JMP/Py/R data analysis, Atlassian Jira/Confluence proficiency, thermo-mechanical and reliability constraints understanding
Technologies
JMP, Py, R, Jira, Confluence
Responsibilities
Coordinate package integration, design, manufacturing and reliability efforts; Work with OSAT and 3rd party vendors to bring product from concept to NPI and HVM; Analyze manufacturing data to provide source-of-truth reports on yield and failure modes; Propose and manage material build plans to support process development and reliability efforts
Seniority
Senior, hands-on IC