Sr Principal Packaging Egineer
Core
Manage image sensor packaging technology development, process improvement, and new product introduction for CSP, BGA, and LGA packages used in automotive, industrial, and consumer sensing systems.
Role type
Senior IC packaging engineer (semiconductor assembly)
Builds
Advanced packaging solutions for image sensors and sensing systems
Domain
Semiconductor manufacturing / Sensor packaging
Deliverable
production ML models | product features | infrastructure
Required skills
Semiconductor assembly packaging development, process engineering, materials development, new product introduction, wafer level CSP assembly, TSV processes, die attach, wire bonding, molding, statistical analysis (DOE), package reliability analysis
Preferred skills
Imager packaging experience, BGA packaging experience, AI tool proficiency (ChatGPT, Microsoft Copilot)
Technologies
CSP, BGA, LGA, TSV, DOE
Responsibilities
Manage image sensor packaging technology development, support corporate product and technology development, interact with design engineering and external suppliers, develop analytical techniques for evaluating new package designs, utilize statistical analysis techniques like DOE
Seniority
Senior, hands-on IC
