Integration Engineer - BCD Technology
Core
Driving advanced BCD technologies from concept through qualification and readiness for volume manufacturing, ensuring robustness and manufacturability across device, process, and integration disciplines.
Role type
Technology BCD Integration Engineer
Builds
Advanced BCD platforms for power, automotive, industrial, and imaging markets
Domain
Semiconductor manufacturing (BCD, BEOL, 300mm)
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
BEOL process integration, MIM capacitor integration, copper metallization, CMP, dielectric integration, post-fab process considerations, cross-module integration decision-making, yield learning, reliability analysis, process window definition, defectivity control
Preferred skills
5S, 8D, 6-sigma, SPC, DOE, FMEA, embedded non-volatile memory integration, ROIC-optimized process flows, low-power/low-noise CMOS development, DMOS performance improvement, packaging readiness
Technologies
300mm semiconductor manufacturing, BEOL stack, MIM capacitors, copper metallization, CMP, dielectric integration
Responsibilities
Drive high-voltage BCD platform enhancements from development through qualification; Integrate embedded non-volatile memory modules into BCD technology; Enable ROIC-optimized process flows and advanced capacitor options; Develop low-power and low-noise CMOS options; Improve DMOS performance and reliability through integration changes; Support packaging and post-fab readiness using standardized test vehicles
Seniority
Mid-level, hands-on IC