Device/Process Integration Engineer (R&D)
Core
Drive leading-edge technology development for embedded and analog businesses by resolving complex integration issues through new processes and process-flow integration.
Role type
Senior IC process integration engineer (semiconductor)
Builds
28nm and 22nm process technologies in a 300mm analog and embedded wafer fab
Domain
Semiconductor manufacturing / Analog and embedded circuits
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
semiconductor device physics, model-based problem solving, process-flow integration, characterization, test, design of experiments (DOE), data analysis, simulation, high-k metal gate (HKMG) development
Preferred skills
cross-functional technical leadership, rapid system/tool/process ramp-up, technical mentoring, project delivery, stakeholder relationship building
Technologies
300mm wafer fab, 28nm, 22nm, HKMG, CMOS
Responsibilities
Apply semiconductor device physics and model-based problem solving to resolve complex integration issues; Lead a team of engineers to develop a section of the process flow; Drive process and device improvements through characterization, test, DOE, data analysis, and simulation; Mentor engineers and share process-integration best-known methods; Partner with process, integration, reliability, packaging, and test engineering teams; Work closely with product groups to optimize process performance
Seniority
Senior, hands-on IC with team leadership