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Device and Process Integration Engineer

Lehi, UT, United States💼 Full-time🗓 2026-03-19 → 2026-07-22

Core

Drive continual improvement of process technologies for advanced analog and embedded devices in a 300mm wafer fab.

Role type

Device and Process Integration Engineer

Builds

Advanced analog and embedded technologies for competitive market products

Domain

Semiconductor manufacturing (300mm analog and embedded wafer fab)

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

semiconductor device physics, process characterization, design of experiments, data analysis, simulation, parametric performance optimization, root cause analysis, product flow creation, cross-functional leadership

Preferred skills

semiconductor solid state physics knowledge, analytical problem solving, data organization, project planning

Technologies

semiconductor process tools, simulation software

Responsibilities

Utilize technical knowledge of semiconductor device physics to enable competitive technology through process and parametric improvements; Drive process and device improvements through characterization, test, design of experiments, data analysis and simulation; Ownership of technology parametric performance; Parametric Cpk improvements; Parametric test dispositions including root cause determination for scrap or outliers; Product flow creation/review; Cross functional team leadership to support the transfer, development, qualification, and manufacturing of advanced analog and embedded technologies

Seniority

Mid-level, hands-on IC

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