PIM (Si Gel Filled) Power Module Development Engineer
Core
Leading end-to-end development of Si-gel filled power modules for automotive and industrial applications, ensuring reliability, performance, and manufacturability.
Role type
Senior IC power module package development engineer
Builds
New power module packages and enabling technologies
Domain
Power electronics / Automotive and industrial applications
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Power module package development, Failure analysis, Reliability testing, Process optimization, Risk management, Statistical analysis (Minitab/JMP)
Preferred skills
SiC device package development, AutoCAD, Cross-functional collaboration
Technologies
Si-gel, SiC, Minitab, JMP, AutoCAD
Responsibilities
Lead package related failure analysis and reliability testing, Define power module package strategy aligned with product roadmap, Establish and optimize packaging processes and specifications, Manage risk, cost, and schedule for packaging programs, Present technical findings and design reviews to stakeholders
Seniority
Senior, hands-on IC