Staff Process Engineer - Mold
Core
Technical expert in transfer molding processes driving optimization, quality improvement, and stable production performance for semiconductor packaging.
Role type
Staff Process Engineer (Transfer Molding)
Builds
Semiconductor packages via transfer molding (IC encapsulation, discrete/power device packaging)
Domain
Semiconductor manufacturing / Electronics packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Transfer molding process optimization, root cause analysis, CAPA implementation, NPI support, Lean/Six Sigma methodologies, yield improvement, cycle time reduction, scrap reduction, technical documentation, cross-functional collaboration
Preferred skills
None stated
Technologies
TOWA, FUSEI, Epoxy Molding Compound (EMC)
Responsibilities
Optimize molding process parameters for stable output; Diagnose and resolve molding defects (flash, bleed, cracking, warpage); Lead root cause analysis and implement corrective actions; Support mold trials, qualification, and NPI; Develop and maintain process specifications; Monitor KPIs for yield and cycle time improvements; Lead continuous improvement initiatives
Seniority
Staff, hands-on IC