塑封工艺工程师/Molding Process Engineer
Core
Oversee the full process control and parameter optimization of semiconductor epoxy molding operations to ensure mass production quality.
Role type
Molding Process Engineer
Builds
Semiconductor packages via epoxy molding
Domain
Semiconductor manufacturing / Packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor packaging process knowledge, mass production line operation logic, material validation, curing process optimization, appearance and electrical consistency control, process capability (CPK) improvement, 8D reporting, yield optimization, cross-functional collaboration
Preferred skills
Automotive chip molding experience, moisture resistance and thermal endurance molding process experience
Technologies
Office software
Responsibilities
Manage full-process control and parameter optimization for semiconductor molding; Resolve mass production defects such as flash, voids, delamination, warpage, and cracking; Validate molding materials and optimize curing processes; Develop process standards and production control documents; Participate in package structure reviews and new product molding scheme implementation
Seniority
Mid-level, hands-on IC