Staff Process Engineer - Die Attach / Clip Attach
Core
Own, develop, and sustain solder die attach and clip attach processes to achieve stable yields, high equipment uptime, and full compliance to reliability and customer requirements in semiconductor manufacturing.
Role type
Staff Process Engineer (Die Attach / Clip Attach)
Builds
Semiconductor module packages with high-reliability requirements
Domain
Semiconductor manufacturing / High-mix assembly
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Solder metallurgy, wetting, void mechanisms, thermal management, surface finishes (ENIG/ENEPIG/Ag/Pd), SPC, MSA/GR&R, PFMEA, Control Plans, DOE, root cause analysis (5-Whys/Ishikawa), data analysis (Minitab/Exensio/Excel), bonding diagrams interpretation
Preferred skills
None stated
Technologies
ASM, ESEC, Minitab, Exensio
Responsibilities
Define and optimize die attach parameters and tooling effectiveness; Establish and maintain recipe management system and process controls; Lead problem solving using 8 Discipline and DMAIC for internal and external issues; Qualify materials (solder paste, flux, substrates, leadframes) and define qualification criteria; Prepare evidence for customer audits (IATF/ISO) and ensure change control compliance; Partner with Production, Equipment, Quality, and NPI to ensure output, OEE, quality, and delivery goals.
Seniority
Staff, hands-on IC with cross-functional leadership