Staff Engineer, External Manufacturing Engineering
Core
Driving continuous improvement in package quality, manufacturing processes, operational efficiency, and system robustness at external subcontractors for ON Semiconductor.
Role type
Staff Engineer, External Manufacturing Engineering (Semiconductor Packaging & Assembly)
Builds
Operational efficiency and quality outcomes for automotive-grade semiconductor products at subcontractor sites.
Domain
Semiconductor manufacturing, specifically packaging and assembly processes.
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor assembly process knowledge (wire bonding), root cause analysis (8D, 3-5 Why), change control management, risk assessment, audit facilitation, yield enhancement, process line drift reduction, material verification (MRB), structured problem-solving.
Preferred skills
VDA 6.3 certification, IATF16949 certification.
Technologies
Wire bond base materials (Ag, Au, Cu, Al), 8D methodology, Is-Is Not analysis.
Responsibilities
Lead task force initiatives for process and quality improvements; ensure process robustness and risk mitigation across subcontractor operations; manage change control processes including risk assessments; serve as communication bridge between Business Units, customers, and project teams; investigate EFAR and SQIN issues and implement corrective actions; deploy and scale Best Known Methods (BKMs); facilitate customer and subcontractor audits; manage daily subcontractor operations with onsite presence; drive continuous improvement for yield enhancement and process line drift reduction; execute qualification activities for change management projects.
Seniority
Staff, hands-on IC with strategic oversight.