Principal External Manufacturing Engineer
Core
Driving continuous improvement in package quality, manufacturing processes, operational efficiency, and system robustness at external subcontractors for ON Semiconductor.
Role type
Principal External Manufacturing Engineer (Semiconductor Packaging & Assembly)
Builds
Semiconductor packages and assemblies for automotive-grade products
Domain
Semiconductor manufacturing, specifically packaging and assembly processes
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor packaging and assembly processes (wire bonding), root cause analysis (8D, 3-5 Why), change control management, risk assessment, audit facilitation, yield enhancement, process line drift reduction, material verification (MRB), cross-functional collaboration
Preferred skills
VDA 6.3 certification, IATF16949 certification
Technologies
Wire bond base materials (Ag, Au, Cu, Al), assembly/test equipment and systems
Responsibilities
Lead task force initiatives for process and quality improvements; Ensure process robustness and risk mitigation across subcontractor operations; Manage change control processes including risk assessments; Investigate EFAR and SQIN issues and implement corrective actions; Deploy and scale Best Known Methods (BKMs) across sites; Facilitate and support customer and subcontractor audits; Manage daily subcontractor operations with strong onsite presence; Execute qualification activities for change management projects involving products, assembly/test processes, equipment, and systems
Seniority
Principal, hands-on IC with strategic oversight