QFN Tech leader
Core
Lead technical development and project management for automotive power semiconductor packages (discrete, QFN, modules), ensuring manufacturability, reliability, and cost targets.
Role type
Senior IC power semiconductor package development leader
Builds
Automotive power module packages and enabling technologies
Domain
Automotive power electronics / Semiconductor packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor package development, Assembly process development, Project management, Design for Manufacturing (DFM), Failure analysis, Process characterization, Reliability engineering, Cost structure analysis, APQP compliance, Design rule management, Technical leadership, Cross-functional collaboration
Preferred skills
Power discrete and Power module package expertise, Power IC knowledge, Project Management certification, JMP & Data analysis
Technologies
QFN, TO220, D-Pak, D2PAK, APM, SPM, IPM, IGBT, Diode module
Responsibilities
Define package internal/external outlines, lead frames, and process flows; conduct DFM reviews with cross-functional teams; generate development deliverables (FMEA, control plans, project charters); execute process optimization and failure analysis; manage project schedules, risks, and milestones; lead technical teams and communicate progress to stakeholders.
Seniority
Senior, hands-on IC with strategic project oversight