Director, Probe and Post Fab
Core
End-to-end leadership of wafer manufacturing activities from electrical probe through post-fab processing, including wafer thinning and back side metallization, ensuring yield, cost, and operational scalability.
Role type
Director, Probe and Post-Fab Operations
Builds
Wafer readiness for assembly, transitioning from electrical qualification to assembly flows
Domain
Semiconductor manufacturing (wafer processing, probe, post-fab)
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor manufacturing operations leadership, automation strategy definition, yield and cost optimization, MES and data integrity management, wafer integrity control (thinning, TTV, warp, bow), back side metallization oversight, organizational development, cross-functional integration
Preferred skills
Advanced degree (MS/PhD), multi-area manufacturing leadership, thin-wafer/power/analog device background, non-fab automation deployment experience
Technologies
MES, SPC, recipe control systems, automation tools
Responsibilities
Define and execute operational, technical, and automation strategies for Probe & Post-Fab; lead stable execution during automation transitions; drive continuous improvement while maintaining production continuity; oversee probe strategies and wafer thickness controls; build and develop high-performing engineering and operations teams; serve as primary interface to front-end fab, assembly, and quality teams
Seniority
Director, strategic leadership & organizational management