Senior Packaging Development Engineer - Leadframe Package/Ceramic
Core
Develop and optimize leadframe and ceramic packaging processes for power stage and multi-chip module (MCM) semiconductor packages.
Role type
Senior IC packaging development engineer (leadframe/ceramic)
Builds
Power stage packages, MCM modules, and system-in-package (SiP) solutions
Domain
Semiconductor manufacturing and packaging
Required skills
Process development (FOL/EOL), JMP statistical analysis, ANSYS/FEA stress modeling, material selection, yield improvement, FMEA, control plan design, SMT/back-end integration, leadframe/DBC/MIS manufacturing knowledge
Preferred skills
System-in-Package (SiP) expertise, Design for Manufacturability (DFM) constraints, multi-process coordination, DOE methodology, substrate design, reliability requirements, project management in semiconductor assembly
Technologies
ANSYS, JMP, JMP statistical analysis software
Responsibilities
Optimize Face2Face Flip Chip & Reflow processes and swivel molding characterization; Define manufacturing process sequences for power stage packages; Manage new product executions from prototyping to release; Collaborate with factory operations to meet quality and cost standards; Execute technology roadmaps for MCM competitiveness; Perform stress modeling to identify design weak points
Seniority
Senior, hands-on IC