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LFAB Yield Ramp (28nm) Branch Manager

Lehi, UT, United States💼 Full-time🗓 2026-02-17 → 2026-07-22

Core

Lead the yield ramp and process integration activities for TI's 28nm analog and embedded wafer fab to achieve yield entitlement.

Role type

Director-level Yield Ramp Manager (28nm)

Builds

28nm analog and embedded semiconductor products

Domain

Semiconductor manufacturing (28nm node)

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

high-volume yield ramp management, process integration, semiconductor device physics, parametric performance optimization, technology transfer leadership, strategic planning, team development, technical problem-solving, project execution, stakeholder management

Preferred skills

advanced semiconductor device characterization, cross-functional collaboration, aggressive goal setting, rapid learning execution, organizational optimization

Technologies

28nm process integration, 65nm/45nm/28nm nodes, analog and embedded devices

Responsibilities

Deliver on aggressive yield ramp schedules, define and set yield ramp team goals, drive daily tactical program priorities, lead technology transfer and development activities, coach and develop leaders in technical understanding and project execution, communicate technology status to senior management

Seniority

Director, hands-on IC leadership

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