Plasma/Dry Etch Manufacturing Process Engineer
Core
Drive the technology ramp for 28nm analog and embedded wafer manufacturing by optimizing dry etch processes and supporting high-volume production.
Role type
Manufacturing Process Engineer (Dry Etch)
Builds
300mm analog and embedded processing chips for power electronics
Domain
Semiconductor manufacturing (300mm wafer fab, 28nm node)
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Dry/Plasma etch process engineering, statistical process control, engineering change control, process release strategies, FEOL Isolation and Gate Etch Processing, BEOL Via/Trench Etch processing
Preferred skills
Analytical and problem solving skills, verbal and written communication, team collaboration, time management, relationship building, initiative
Technologies
28nm technology, 300mm wafer fab, STI, GATE, Contact, Flash integration, FEOL, BEOL
Responsibilities
Develop and implement improved manufacturing methods and procedures, execute equipment/process startup and process experiments, perform lot and equipment dispositions, identify and resolve systematic process or equipment problems, participate in data analysis and problem resolution
Seniority
Mid-level, hands-on IC