LFAB Device & Process Integration Branch Manager
Core
Lead the Process Integration team in a 300mm analog and embedded wafer fab, driving parametric performance, yield improvement, and technology transfers for 65nm and below nodes.
Role type
Director-level Process Integration Branch Manager
Builds
Semiconductor devices and integrated circuits for analog and embedded applications
Domain
Semiconductor manufacturing (300mm fab), 65nm and below nodes
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor device physics, process integration, parametric data ownership, technology transfer, strategic planning, team leadership, problem-solving
Preferred skills
None stated
Technologies
300mm fab, 65nm-28nm process nodes
Responsibilities
Own parametric performance and yield improvement, lead technology transfer and development, define and execute strategic roadmaps, coach and develop leaders, drive technical discussions on component performance and integration, manage daily tactical factory priorities
Seniority
Director, manager of managers