Product Development Engineer (28nm)
Core
Lead the technology ramp and yield optimization for 28nm analog and embedded wafer manufacturing facilities.
Role type
Senior IC product development engineer (semiconductor manufacturing)
Builds
28nm analog and embedded processing chips for power electronics and diverse semiconductor portfolios
Domain
Semiconductor manufacturing, 28nm node, analog/embedded devices
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
28nm technology expertise, semiconductor device principles, production test data analysis, failure analysis, statistical analysis tools (JMP, Excel), process troubleshooting, design verification collaboration
Preferred skills
Memory mapping tools, ATPG diagnostics (Cadence Modus, Synopsys Tetramax), electrical failure analysis instrumentation, wafer-level yield analysis, digital/mixed-signal IC design, analog/mixed-signal circuit design (OP Amps, ADCs, DACs, RF), memory architecture (SRAM, Flash), semiconductor fabrication processes
Technologies
JMP, Excel, Cadence Modus, Synopsys Tetramax, Avalon layout database
Responsibilities
Conduct yield issue analysis and implement corrective actions, characterize and qualify new products for production release, address daily production challenges and process troubleshooting, lead productivity and cost reduction initiatives, utilize statistical tools for engineering decisions, collaborate with design teams on simulation and silicon debug
Seniority
Senior, hands-on IC