IC package design engineer
Core
Develop complex ASIC package designs from early planning through tapeout for high-speed networking silicon products.
Role type
IC package design engineer
Builds
High-speed, robust, and manufacturable package solutions for Cisco Switching, Routing, and Wireless products
Domain
Semiconductor hardware design / Advanced packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Package design, PCB design, high-speed signal design, power distribution networks (PDN), EDA tools for layout, cross-functional collaboration
Preferred skills
Advanced packaging technologies, interposers, multi-die systems, silicon floor planning, signal integrity (SI), power integrity (PI)
Technologies
EDA tools for layout
Responsibilities
Lead package design activities including planning, floorplanning, pinout optimization, stack-up definition, and high-speed routing support; Collaborate with SI/PI, silicon floorplanning, layout, and manufacturing teams; Support package implementation and alignment with layout designers; Participate in technical investigations, design reviews, and tradeoff discussions; Develop and improve package design methodologies and best practices; Contribute to debugging, issue resolution, and package bring-up activities
Seniority
Individual Contributor (IC)
