Product Design Engineer - SiP NPI
Core
Develop next-generation System-in-Package (SiP) processes from concept to high-volume manufacturing, serving Apple's end products.
Role type
Senior IC packaging process engineer (SiP NPI)
Builds
Next-gen SiP architectures, robust process flows, and high-yield semiconductor packages
Domain
Semiconductor packaging / Electronics manufacturing
Required skills
IC packaging process expertise, SMT, underfill, molding, dicing, laser processes, process development, OSAT team leadership, failure analysis, material characterization, mechanical simulation, statistical process control (SPC), Cpk analysis
Preferred skills
Transfer molding with fine pitch IC, assembly process qualification, design for experiments, JMP data analysis, quality tools (commonality study)
Technologies
SMT, underfill, molding, dicing saw, laser processes, JMP
Responsibilities
Define next-gen SiP architecture based on functionality and form factor; assess process risks and validate options with internal RD or OSAT teams; lead process development in POC and NPI builds including material down-selection and equipment qualification; troubleshoot process failures and drive corrective actions; drive yield improvement and cost reduction with vendors
Seniority
Senior, hands-on IC
