Principal Package Engineer
Core
Lead advanced semiconductor packaging solutions for Silicon devices and chiplet architectures, driving design, qualification, and manufacturing bring-up for Azure datacenter products.
Role type
Principal IC Package Engineer (Advanced Packaging)
Builds
Custom Silicon devices, 2.5D/3D packaging solutions (bridge/interposer/substrate), and test vehicles.
Domain
Semiconductor / Advanced Packaging / Datacenter Hardware
Required skills
Advanced semiconductor packaging design (2.5D/3D, BGA), supplier management, FMEA, thermo-mechanical FEA, high-speed signaling co-design, test vehicle strategy, OSAT/Foundry technology knowledge, physical failure analysis, EDA tool definition.
Preferred skills
Cross-functional team leadership, risk mitigation strategies, manufacturing quality/reliability drive.
Technologies
2.5D/3D packaging, BGA, Interposer, Substrate, EDA tools, FEA simulation tools, OSAT/Foundry platforms.
Responsibilities
Support design and implementation of new custom Silicon devices; evaluate and recommend new packaging technologies; drive 2.5D/3D packaging product designs from definition to tapeout; define and develop test vehicles to validate Silicon, Package, and System performance; manage suppliers through definition, development, qualification, and production; develop and deliver FMEA for technology options; design package and assembly drawings for manufacturing; drive quality and reliability in development and production.
Seniority
Principal, hands-on IC with strategic oversight
