Director of Package Design
Core
Lead a team of package design engineers to drive optimal silicon packaging solutions for Azure datacenter products, focusing on chiplet architecture and advanced 2.5D/3D packaging.
Role type
Director of Package Design (Senior IC/Manager)
Builds
2.5D/3D packaging product designs (bridge/interposer/substrate), test vehicles, and manufacturing assembly drawings
Domain
Semiconductor manufacturing / Advanced packaging / Datacenter hardware
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Team leadership and mentorship, Supplier assessment and management, FMEA development, EDA tool requirements definition, Package and assembly drawing design, Cross-functional collaboration, Advanced packaging technology knowledge, IC package/PCB layout CAD proficiency, 2D/3D simulation for power and signals analysis, Physical failure analysis
Preferred skills
Experience with OSAT and Foundry technologies, High-speed signaling and thermal co-design expertise
Technologies
Cadence Allegro, 2.5D/3D packaging tools, EDA tools
Responsibilities
Mentor package design engineers, Drive chiplet architecture package technology, Define and develop test vehicles, Manage supplier qualification and production, Develop FMEA for technology options, Design package and assembly drawings for manufacturing
Seniority
Director, hands-on IC with team leadership
