Senior or Principal Technical Program Manager
Core
Leads complex multi-disciplinary initiatives driving innovation in microsystems technology, orchestrating collaboration across internal teams and external partners to ensure strategic alignment and timely execution.
Role type
Senior or Principal Technical Program Manager (Semiconductor Packaging & Microsystems)
Builds
Advanced microsystems roadmaps, 3D heterogeneous integration platforms, and chiplet-based architectures for defense electronics and commercial markets.
Domain
Semiconductor manufacturing, advanced packaging, microelectronics, AI, quantum computing, and high-performance computing.
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Advanced packaging technologies expertise, heterogeneous integration techniques, semiconductor fabrication processes, EDA flows, cross-functional program leadership, risk mitigation, stakeholder management, technical documentation, industry trend analysis
Preferred skills
MS or PhD in EE/CE/Mechanical/Materials Science, end-to-end program ownership, vendor/partner management, leading semiconductor foundry experience
Technologies
2.5D interposers, through-silicon vias, wafer-level packaging, 3D stacking, RDL/interposer technologies, EDA vendor flows
Responsibilities
Lead planning, execution, and delivery of cross-disciplinary programs; Develop and manage program scopes, schedules, budgets, and risk mitigation plans; Coordinate efforts across internal R&D, process development, design automation, and partner organizations; Serve as central liaison between technical teams, university researchers, and external stakeholders; Drive metrics-based accountability and communication across all program tracks; Identify dependencies, anticipate bottlenecks, and proactively resolve issues; Support generation of technical documentation, customer deliverables, and integration roadmaps; Monitor industry trends in advanced packaging, 3DHI, and chiplet-based architectures
Seniority
Senior (8+ years) or Principal (10+ years), hands-on IC with strategic oversight