Senior or Principal Product Manager, Texas Institute for Electronics
Core
Drive product strategy and roadmap for TIE's advanced 2.5D/3D microsystems integration platforms, bridging technical teams and customer requirements to align engineering execution with market needs.
Role type
Senior or Principal Product Manager (Semiconductor Packaging & Advanced Integration)
Builds
2.5D/3D microsystems integration platforms, chiplet-based architectures, and multi-component microsystems for defense electronics and commercial markets.
Domain
Semiconductor manufacturing, advanced packaging, microelectronics, AI, quantum computing, HPC.
Deliverable
product features
Required skills
Advanced packaging technologies (2.5D interposers, TSV, wafer-level packaging, 3D stacking, RDL), heterogeneous integration, semiconductor fabrication processes, EDA flows (PDK/ADK), market trend analysis, cross-functional collaboration, technical documentation, program planning.
Preferred skills
MS or PhD in EE/CE/Mechanical/Materials Science, program leadership, vendor/partner management, prior experience at a leading semiconductor foundry or packaging house.
Technologies
2.5D interposers, through-silicon vias (TSV), wafer-level packaging, 3D stacking, RDL, EDA vendor flows.
Responsibilities
Own product strategy and roadmap; author Product Requirements Documents (PRDs); drive cross-functional collaboration; engage with customers and industry partners; serve as technical champion for 2.5D/3D integration; develop program plans; create technical documentation; monitor market trends.
Seniority
Senior (5+ years) or Principal (10+ years), hands-on IC with strategic ownership.
