Post Doctoral Fellow - ECE
Core
Conduct and lead applied and fundamental research in microelectronics, advanced packaging, and design enablement to advance heterogeneous integration.
Role type
Postdoctoral Research Fellow (Microelectronics/Advanced Packaging)
Builds
Research outcomes and pilot manufacturing capabilities for national security and domestic economic growth
Domain
Semiconductor manufacturing, advanced packaging, heterogeneous integration
Deliverable
research
Required skills
IC physical design flow, EDA tools (Cadence, Synopsys/Ansys, Siemens), integrated circuit design, packaging, electronic design automation
Preferred skills
multi-physics simulations (thermal, mechanical, reliability), EDA R&D, chip tape-out, applied ML, modeling, optimization
Technologies
Cadence, Synopsys, Ansys, Siemens
Responsibilities
Conduct and lead applied and fundamental research in microelectronics, advanced packaging, and design enablement; Collaborate with engineers and scientists on heterogeneous integration advancements
Seniority
Early-career researcher (Postdoc)