Design Engineer I - II or Senior Design Engineer, Texas Institute for Electronics
Core
Design and develop mixed-signal circuits, test vehicles, and structures to support 2.5D & 3D semiconductor packaging solutions.
Role type
Senior IC design engineer (semiconductor packaging)
Builds
2.5D/3D heterogeneous micro-systems and chiplet assemblies
Domain
Semiconductor manufacturing / Advanced packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
mixed-signal circuit design, semiconductor device physics, multi-physics modeling (power/thermal/mechanical/RF), EDA tool proficiency, Python/C++/MATLAB scripting, BIST methodology, industry design standards
Preferred skills
multi-material design (Silicon/III-V/Glass), stress/strain interconnect optimization, wire bonding/flip-chip/wafer-level packaging, 3D integration
Technologies
Python, C++, MATLAB, EDA tools
Responsibilities
Design mixed-signal circuits and test structures for 3D-ADK; Develop workflows and standard cells for multi-chiplet systems; Collaborate with EDA vendors to improve tool capabilities; Execute experiments to optimize packaging performance and reliability; Conduct rigorous simulation and 3DHI modeling studies for device performance and testability.
Seniority
Senior, hands-on IC
