Lead Photonics Engineer
Core
Lead engineer for Co-Packaged Optics (CPO) systems, focusing on manufacturing line bring-up, yield improvement, and process design.
Role type
Lead Photonics System Engineer (Manufacturing & NPI)
Builds
Co-Packaged Optics (CPO) systems, optical engines, transceivers, and networking racks for datacom/telecom clients.
Domain
Datacom/Telecom, Photonics, Optical Communication
Deliverable
production ML models | product features | dashboards & analysis | infrastructure
Required skills
Optical communication links expertise, R&D/manufacturing test methods, DC/RF electro-optical test bench setup, Python coding, yield analysis, root-cause investigation, DFM/FMEA guidance, process design, factory operations collaboration.
Preferred skills
Advanced degree in EE or Applied Physics, experience with manufacturing partners, NPI and volume manufacturing ramp phases, photonics packaging, fiber-optic connectivity solutions.
Technologies
Python, DC/RF electro-optical test benches, fiber-optic connectivity solutions, blind-mate connectors, shuffle cables.
Responsibilities
Provide subject matter expertise for manufacturing line bring-up and NPI activities; develop test strategies and quality control gates; define yield and throughput dashboards; engage with clients to capture specifications; support product design with DFM and FMEA; train factory product engineers; improve processes and yield; evaluate and qualify new fiber-optic connectivity solutions.
Seniority
Lead, hands-on IC with strategic process ownership
