IC Packaging Design Intern
Core
Design IC chip carriers for electronic components and pluggable modules, supporting high-speed transmission lines and sensitive power domains.
Role type
IC packaging design intern
Builds
IC chip carriers and pluggable modules for high-performance optical networking
Domain
Semiconductor / Electronic Packaging / Signal Integrity
Deliverable
product features
Required skills
CAD tools, circuit layout, physical assembly design, mechanical outlines, 3D electromagnetic simulation support, thermo-mechanical analysis support, electrical card design, mechanical design, frequency analysis, analog electronic circuit fundamentals, tolerance analysis
Preferred skills
advanced manufacturing experience, electrical card design tools (Cadence Allegro, Keysight ADS), mechanical design tools (Autocad, Draftsight, Solidworks)
Technologies
Cadence Allegro, Keysight ADS, Autocad, Draftsight, Solidworks
Responsibilities
Design IC chip carriers contained in electronic components or pluggable modules; support circuit layout of mini-panels with high-density high-speed transmission lines; perform physical assembly design and mechanical outlines; support signal integrity experts with layout generation for 3D electromagnetic simulations and thermo-mechanical analysis
Seniority
Intern
