Associate Packaging Engineer
Core
Designing semiconductor packages to protect and interconnect integrated circuits for data communications and video broadcast industries.
Role type
Associate Packaging Engineer
Builds
Advanced semiconductor packages for data communications and video broadcast ICs
Domain
Semiconductor manufacturing and packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Manufacturing engineering oversight, SAP system proficiency, Agile methodology, WLCSP packaging, RDL technology, flip-chip BGA, System in Package (SiP), high-density substrate design, PCB design, JEDEC specification JESD47H understanding, EDA tool usage (Cadence, Artwork Qckvu, Asitic, DraftSight), raw material inventory management, quality deviation tracking
Preferred skills
Master's degree in Mechanical/Electrical/Industrial Engineering, prior semiconductor packaging/assembly experience
Technologies
SAP, Agile, WLCSP, RDL, flip-chip BGA, SiP, high-density substrate, PCB design, Cadence Advanced Package Designer, Artwork Qckvu, Asitic, DraftSight, JEDEC JESD47H
Responsibilities
Oversee manufacturing engineering across worldwide suppliers for prototypes and samples, serve as technical contact between engineering/operations/quality teams, prepare engineering documentation and assembly instructions, select and manage raw material inventory, track quality deviations and drive resolution
Seniority
Associate, entry-level IC
