Principal Application Engineer
Core
Lead customer technical engagements for Cadence thermal simulation flow across 2.5D/3D-IC/package/PCB/electronic products.
Role type
Principal Application Engineer
Builds
Thermal simulation flows for 2.5D/3D-IC/package/PCB/electronic products
Domain
Semiconductor/IC packaging and electronic cooling
Deliverable
client delivery
Required skills
Thermal simulation, Electronic cooling, Python scripting, Mechanical simulation, Customer engagement, Technical training, Problem-solving
Preferred skills
Master's degree, Advanced mechanical simulation, Complex thermal problem analysis
Technologies
Python, Thermal simulation tools, Mechanical simulation tools
Responsibilities
Build up thermal simulation flow for 2.5D/3D-IC/package/PCB/electronic products, Drive customer technical engagements through onsite support and workshops, Gather customer feedback to enhance tool functionality, Establish technical credibility with customers
