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Product Engineer II (DDR IP)

2 Locations💼 Full-time🗓 2026-03-26 → 2026-07-30

Core

Pre-sales and post-sales technical support for high-performance Memory PHY IP products (DDR, LPDDR, HBM, GDDR), acting as the primary interface between customers, R&D, and System Validation teams.

Role type

Product Engineer II (Memory IP)

Builds

Memory subsystem products (Controller + PHY) for consumer, hyperscale computing, 5G, automotive, aerospace, industrial, and health applications.

Domain

Electronic design automation (EDA), semiconductor IP, memory protocols

Deliverable

client delivery

Required skills

DDR/LPDDR/HBM/GDDR IP knowledge, Verilog RTL design, gate-level verification, synthesis, static timing analysis, DFT flows, package and board design review, SI/PI review participation

Preferred skills

Memory PHY and DSP architecture experience, embedded microcontroller firmware experience

Technologies

DDR5/4/3, LPDDR5/4/3, HBM3, GDDR6, Verilog, RTL, gate-level simulation

Responsibilities

Supporting pre-silicon integration and implementation of memory subsystem products; assisting with internal system integration and QA testing; analyzing and resolving complex subsystem application issues; supporting SOC integration reviews; assisting customers with RTL and gate-level simulations; assisting with timing closure and physical integration; participating in product documentation development; supporting post-silicon bringup and production test activities; leveraging AI-powered tools for productivity and analytics

Seniority

Mid-level IC engineer (2+ years experience)

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