Senior Engineer, Semi Packaging Engineering
Core
Drive package development and deployment within the New Product Introduction (NPI) pipeline for semiconductor solutions.
Role type
Senior IC packaging engineer (NPI)
Builds
Robust, scalable semiconductor packaging solutions for global Business Units
Domain
Semiconductor manufacturing and packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor assembly processes, package qualification methodologies, 2D AutoCAD, project management from concept to production, cross-functional collaboration, supply chain risk mitigation, data analytics (KNIME)
Preferred skills
Systems integration, NPI systems development, assembly master data structures, OSAT/subcontractor ecosystem experience, simulation tools (Flotherm, ANSYS)
Technologies
AutoCAD, KNIME, RDBMS, Flotherm, ANSYS
Responsibilities
Define, develop, and release semiconductor packaging solutions; Partner with design, reliability, QA, and operations teams; Lead operations-initiated projects for supply chain resiliency and cost optimization; Contribute to NPI systems architecture and continuous improvement; Utilize data-driven approaches to improve development cycle time.
Seniority
Senior, hands-on IC
