C2C Bonding Engineer
Core
Lead development, optimization, and manufacturing integration of advanced Copper-to-Copper (C2C) bonding processes for next-generation CMOS Image Sensors (CIS).
Role type
Senior IC process integration engineer (C2C bonding)
Builds
Advanced wafer bonding technologies for stacked image sensors
Domain
Semiconductor manufacturing / Advanced packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
C2C bonding process development, Module integration, Far BEOL process expertise, Yield/Reliability analysis, Critical dimension control, Failure modeling
Preferred skills
Lithography, Etch, Diffusion, Thin Films Deposition, Wet Cleans, CMP, Systematic yield improvement
Technologies
C2C bonding, Far BEOL, CMOS Image Sensors (CIS)
Responsibilities
Own Module Integration for Bonding and farBEOL steps, Lead projects to cure systematic yield/reliability issues, Review Process changes at Change Control Board, Provide Yield risk assessment and failure modeling at Material Review Board
Seniority
Senior, hands-on IC
