CVD Process Engineer - Wafer Bonding
Core
Deliver technical leadership in wafer bonding and de-bonding processes, ensuring 24/7 operation, troubleshooting issues, and transferring processes from development to high-volume manufacturing.
Role type
Senior IC CVD Process Engineer (Wafer Bonding)
Builds
Wafer bonding/de-bonding processes for advanced semiconductor devices
Domain
Semiconductor manufacturing / Wafer processing
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Wafer bonding/de-bonding equipment operation, Process experiment design, Troubleshooting, FMEA management, Preventative maintenance planning, Cross-functional collaboration, Data analysis, Project management, Clean room work
Preferred skills
Hybrid bonding techniques, Semiconductor equipment knowledge (vacuum, RF, plasma, MFCs), Programming (VBA, Python, R, SQL), Sensor data interpretation
Technologies
Bonding/de-bonding equipment, Vacuum systems, RF systems, Plasma, MFCs, Pneumatic valves
Responsibilities
Prepare and calibrate bonding/debonding equipment, Ensure tool-to-tool matching, Develop preventative maintenance schedules, Investigate bonding issues and apply corrective actions, Lead development experiments for yield/reliability improvement, Provide technical training to operators
Seniority
Senior, hands-on IC
