Senior/Staff ChipFab Process Engineer

Malaysia-Penang B 1 & 2Full-time2026-11-01 → 2026-11-10

Core

Own Chip Fab backend processes for laser devices, driving productivity, yield, quality, and reliability across subcontractor facilities.

Role type

Senior/Staff IC process engineer (backend manufacturing)

Builds

Wafer scribe, stacking, and unstacking processes for laser devices (DFB, EML, VCSEL)

Domain

Semiconductor manufacturing (laser devices, InP, GaAs)

Required skills

wafer scribing, stacking, and unstacking operations, tool qualification, NPI, CAPA, SPC, FMEA, OCAP, root cause analysis, statistical data analysis, JMP scripting, process capability indices (Cpk, Ppk), equipment reliability metrics (MTBA, MTBF)

Preferred skills

AutoCAD, SolidWorks

Technologies

JMP, Tableau, SQL, AutoCAD, SolidWorks

Responsibilities

Lead buy-off and qualification of new equipment, drive New Process Integration (NPI) and formal process transfers, perform deep-dive root cause analysis and implement CAPA, define and execute comprehensive process control plans, establish dashboards and KPIs to track process health, create and maintain Standard Operating Procedures (SOPs)

Seniority

Senior/Staff, hands-on IC

About Broadcom

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.