Principal/Master Engineer – Silicon Photonics Advanced Packaging
Core
Lead packaging and assembly development for a scalable silicon photonics platform, bridging design and volume manufacturing using 2.5D/3D technologies.
Role type
Principal/Master Engineer (Silicon Photonics Advanced Packaging)
Builds
Wafer- and chip-scale packaging processes for silicon photonics platforms
Domain
Semiconductor manufacturing / Silicon Photonics / Advanced Packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Advanced packaging design, 2.5D/3D integration techniques, OSAT/CM management, yield optimization, NPI management, opto-mechanical design, substrate definition, DFM rule establishment
Preferred skills
Silicon photonics product track record, wafer-level assembly expertise, chip-scale packaging experience
Technologies
2.5D/3D packaging, wafer-scale assembly, chip-scale packaging
Responsibilities
Lead advanced packaging design and assembly process development; Partner with PIC/IC and opto-mechanical teams to align architectures with requirements; Manage OSATs/CMs through assembly development and NPI; Troubleshoot assembly issues and drive yield optimization; Define and enforce packaging specifications and DFM rules
Seniority
Principal, hands-on IC with strategic leadership
