Substrate Engineer
Core
Manage and resolve issues relating to packaging, manufacturing, yield, quality, and delivery of high volume semiconductor devices for Broadcom's IC substrate subcontractors.
Role type
Senior IC substrate manufacturing engineer
Builds
High volume semiconductor devices (IC substrates)
Domain
Semiconductor manufacturing / IC packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
IC substrate manufacturing technologies, NPI activity, risk assessments, process improvement, production engineering support, new product pre-production engineering, Best Known Methods standardization, cost reduction, failure analysis, problem solving methodologies, complex activity coordination, manufacturing operations management, packaging subcontractor management, visual mechanical yield improvement, cycle time optimization
Preferred skills
SMT processibility knowledge, component quality interactions
Technologies
ABF substrates, Ball Grid Arrays, flipchip, laminate substrates, die attach, wirebonding, molding, singulation, packaging materials
Responsibilities
Manage and resolve issues with packaging subcontractors regarding manufacturing and delivery; Lead NPI activity and process development; Drive improvements in process yields and cycle time; Standardize Best Known Methods across sites; Coordinate complex activities across operations, quality, suppliers, and customers; Perform risk assessments and manage escalations.
Seniority
Senior, hands-on IC
