Process Engineer I-IV
Core
Provide process engineering support for Reactive Ion Etch (RIE/Plasma Etch) equipment sales and development to the semiconductor industry, focusing on advanced process nodes (2nm, 14A, 10A) in FEOL and BEOL dry etch modules.
Role type
Process Engineer (IC)
Builds
Advanced dry etch processes for semiconductor manufacturing
Domain
Semiconductor manufacturing / Plasma etch technology
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Plasma etch process development, Design of Experiments (DOE), Statistical Process Control (SPC), cleanroom operations, metrology and characterization, Hitachi plasma etch systems operation, data analysis and reporting
Preferred skills
Semiconductor equipment experience, cleanroom/Fab experience, plasma science fundamentals
Technologies
Hitachi plasma etch systems, metrology equipment
Responsibilities
Execute process development, optimization, and DOE-driven tuning to meet customer specifications; support ramp of high-volume manufacturing etch processes; troubleshoot etch module performance; interface with internal customers and global engineering teams; create technical documentation and presentations
Seniority
Entry to Senior (I-IV), hands-on IC
