Principal Engineer – RIE Module Engineering
Core
Provide technical leadership and strategic direction for Reactive Ion Etch (RIE) manufacturing operations, owning module-level performance across safety, quality, yield, availability, cost, and output.
Role type
Principal Engineer – RIE Module Engineering
Builds
RIE manufacturing modules and processes for semiconductor fabrication
Domain
Semiconductor manufacturing / Plasma etch
Required skills
RIE process and equipment expertise, statistical process control (SPC), DOE methodology, Fault Detection and Classification (FDC), Advanced Process Control (APC), yield analysis, root cause analysis, FMEA, process qualification methodologies, data analytics
Preferred skills
Chamber matching, endpoint systems, automotive/power semiconductor/image sensor technology experience, TEL/Lam Research platform experience
Technologies
SPC, FDC, APC, DOE, FMEA
Responsibilities
Develop and execute module strategy aligned to fab objectives for yield, availability, cycle time, cost, and quality; Architect control strategies utilizing SPC, FDC, APC, and advanced analytics; Lead cross-functional teams consisting of Process Engineering, Equipment Engineering, Manufacturing, Quality, Facilities, and Product Engineering; Mentor and coach engineers across multiple levels; Develop business cases supporting capital investments, upgrades, and productivity projects
Seniority
Principal, technical authority & strategic leadership