Research Engineer II (Semiconductor Fabrication (Heterogeneous Integrated Photonics))
Core
Fabricate integrated photonic devices end-to-end in a shared cleanroom, including lithography, etching, deposition, and heterogeneous integration.
Role type
Research Engineer II (Semiconductor Fabrication)
Builds
Integrated photonic devices for semiconductor-laser, RF-photonics, and heterogeneous-integration projects.
Domain
Semiconductor industry, photonics, heterogeneous integration.
Required skills
Lithography (e-beam/DUV/i-line), Dry etching (ICP-RIE/RIE), Thin-film deposition (PECVD/LPCVD, sputtering, ALD, e-beam), Metallization, Wafer bonding, Substrate thinning/CMP, Optical/electrical characterization, Yield/failure analysis, MATLAB, Python, Cleanroom safety compliance.
Preferred skills
None stated.
Technologies
e-beam lithography, DUV lithography, i-line lithography, ICP-RIE, RIE, PECVD, LPCVD, Sputtering, ALD, e-beam deposition, Lift-off, Annealing, Plasma-activated bonding, Adhesive bonding, Eutectic bonding, SEM, AFM, Ellipsometry, Reflectometry, Profilometry.
Responsibilities
Fabricate integrated photonic devices end-to-end in a shared cleanroom; Run core process modules including lithography, etching, deposition, and metallization; Perform heterogeneous integration and bonding; Conduct optical/electrical device characterization and metrology; Perform yield and failure analysis.
Seniority
Mid-level, hands-on IC.