Research Engineer II (Semiconductor Fabrication (Heterogeneous Integrated Photonics))
Core
Fabricate integrated photonic devices end-to-end in a shared cleanroom, including lithography, etching, deposition, and heterogeneous integration.
Role type
Research Engineer II (Semiconductor Fabrication)
Builds
Integrated photonic devices for semiconductor-laser, RF-photonics, and heterogeneous-integration projects
Domain
Semiconductor industry / Integrated Photonics
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
e-beam/DUV/i-line lithography, ICP-RIE/RIE etching, PECVD/LPCVD, sputtering, ALD, e-beam deposition, lift-off, metallization, annealing, wafer cleaving/dicing, facet preparation, plasma-activated/adhesive/eutectic wafer-die bonding, substrate thinning/CMP, optical/electrical device characterization, metrology (SEM, AFM, ellipsometry, reflectometry, profilometry), yield/failure analysis, MATLAB, Python
Preferred skills
None stated
Technologies
e-beam, DUV, i-line, ICP-RIE, RIE, PECVD, LPCVD, sputtering, ALD, e-beam deposition
Responsibilities
Fabricate integrated photonic devices end-to-end in a shared cleanroom; Run core process modules including lithography, etching, deposition, and lift-off; Perform heterogeneous integration and bonding; Conduct optical/electrical device characterization and metrology; Perform yield and failure analysis.
Seniority
Mid-level IC
