Package R&D Engineer (New Grad)
Core
Develop new package types and structures for integrated power semiconductors, surveying materials to meet process, reliability, and cost requirements.
Role type
New Grad Package R&D Engineer
Builds
Next-generation power delivery packages
Domain
Semiconductor industry, power electronics
Deliverable
product features
Required skills
Package development principles, semiconductor supply chain knowledge, familiarity with assembly sub-contractors and packaging material vendors, AutoCAD or Cadence software
Preferred skills
Knowledge of package design rules and road map maintenance
Responsibilities
Survey new materials for package processes and reliability; Collect packaging requirements from TME, DE, Marketing, and competitors; Maintain package design rules and update package road map
Seniority
Entry-level, new graduate
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