Engineer, Material
Core
Drive packaging material qualification, material improvements, and supplier quality management to support manufacturing cost, quality, delivery, and risk objectives for semiconductor manufacturing.
Role type
Material Engineer (Semiconductor Manufacturing)
Builds
Packaging materials (trays, carrier tapes, moisture barrier bags, etc.) and qualification reports for semiconductor manufacturing.
Domain
Semiconductor manufacturing / Materials Engineering
Required skills
Material qualification, Statistical Process Control (SPC), Root cause analysis (8D), Supplier quality management, Laboratory equipment operation, Change management, Data analysis (JMP)
Preferred skills
AI tool integration, Semiconductor industry experience, Leadership, Digital fluency
Technologies
JMP, GDMS, SQN, 6S standards
Responsibilities
Execute packaging material qualification testing (ESD, drop, vibration, water leak), manage supplier quality issues and corrective actions, maintain laboratory equipment and 6S standards, apply statistical tools for continuous improvement, conduct change management for material updates.
Seniority
Entry to Mid-level (0-2 years experience preferred)
