Senior Packaging Materials R&D Engineer
Core
Drive innovation and performance improvement in key packaging materials (epoxy, molding compounds, underfill) to ensure resilient, cost-effective supply chains for advanced semiconductor packaging.
Role type
Senior IC Materials R&D Engineer (Semiconductor Packaging)
Builds
Next-generation packaging materials (Epoxy die-attach adhesives, Molding compounds for fan-out/SiP, underfill materials)
Domain
Semiconductor industry / Advanced Packaging Materials
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Chemistry and formulation expertise, Material characterization (TGA, DMA, rheology), Reliability testing (MSL, TCT, HAST), Failure mode analysis, Supplier qualification and management, Process compatibility evaluation
Preferred skills
None stated
Technologies
TGA, DMA, rheology, MSL, TCT, HAST
Responsibilities
Develop and qualify 2nd source domestic suppliers for packaging materials; Define material specifications, performance targets, and qualification plans; Conduct technical analysis on material properties and failure mechanisms; Collaborate with suppliers and internal teams to optimize formulations; Lead technical assessment and full qualification cycles for new suppliers/materials
Seniority
Senior, hands-on IC
