Senior Ingenieur / Physiker Semiconductor Packaging (w/m/d)
Core
Develop customer-specific adhesive solutions and process integration for microelectronic packaging, providing technical consulting and implementing technologies in client manufacturing processes.
Role type
Senior IC semiconductor packaging engineer (adhesive technologies)
Builds
Custom adhesive solutions and integrated manufacturing processes for semiconductor clients
Domain
Semiconductor industry / Microelectronic packaging / Adhesive technologies
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Adhesive technology expertise, process integration, technical consulting, feasibility study leadership, cross-functional collaboration, continuous technical learning
Preferred skills
Project management experience, international travel readiness, analytical thinking
Technologies
Adhesive technologies, microelectronic packaging processes
Responsibilities
Solve complex adhesive technical challenges, develop customer-specific solutions up to process integration, provide technical consulting to international clients, implement technologies in client manufacturing processes, conduct feasibility studies and derive necessary conclusions
Seniority
Senior, hands-on IC
